20January2017

Nano-Micro Letters

Editor-in-Chief  

Yafei (Anderson) Zhang 

Director, Thin Film and Microfabrication Technology Laboratory of Ministry of Education 

School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, China 

E-mail: yfzhang@sjtu.edu.cn 

  

  

Co-Editors 

Yoshinori Ando 

Department of Materials Science and Engineering, Meijo University, Japan 

Shiogamaguchi 1-501, Tempaku-ku, Nagoya, Japan E-mail: yando@ccmfs.meijo-u.ac.jp

Zhiming M. Wang 

Professor of National 1000-Talents Program, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China. E-mail: zhmwang@gmail.com 

   

Associate Editors 

Yarub Al-Douri, Institute of Nano Electronic Engineering, University Malaysia Perlis, Malaysia 

Changxin Chen, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China

Kwang-Leong Choy, Director of the UCL Centre for Materials Discovery, University College of London, UK 

Xinliang Feng, Max Planck Institute for Polymer Research, Germany

Jing Guo, Department of Electrical and Computer Engineering, University of Florida, USA

Shaoming Huang, College of Chemistry and Materials Engineering, Wenzhou University, China  

Chun-Sing Lee, Department of Physics & Materials Science, City University of Hong Kong, Hong Kong, China

Hyoyoung Lee, Sungkyunkwan University, Korea, Republic Of 

Lijie Li, School of Engineering, Swansea University, UK

Jingquan Liu, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China

Guoquan Min, Shanghai Nano Technology Promotion Center, China 

Xiaoming Niu, Zhangjiang Hi-tech Park, China

Jianyong Ouyang, Department of Materials Science and Engineering, Faculty of Engineering, National University of Singapore, Singapore   

LOH Kian Ping, Department of Chemistry, Faculty of Science, National University of Singapore, Singapore

Zhitang Song, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China 

Hui Wang, Department of Physics and Astronomy, Shanghai Jiao Tong University, China

Zhichuan J. Xu, School of Materials Science and Engineering, Nanyang Technological University, Singapore

Jun Yang, Department of Mechanical and Materials Engineering, The University of Western Ontario, Canada

Zhi Yang, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China

Qing Zhang, Nanyang Technological University, Singapore

Wenjun Zhang, Department of Physics and Materials Science City University of Hong Kong, Hong Kong, China

Zhaohui Zhong, Department of Electrical Engineering and Computer Science, University of Michigan, USA

Baoxue Zhou, School of Environmental Science and Engineering, Shanghai Jiao Tong University, China

  

Editorial Board Members 

Anil K. Bhowmick, Rubber Technology Centre, Indian Institute of Technology, India

Hugh J. Byrne, Dublin Institute of Technology, Ireland 

Antonio Guerrero Castillejo, Institute of Advanced Materials, Universitat Jaume I, Spain

Jingsheng Chen, Department of Materials Science and Engineering, Faculty of Engineering, National University of Singapore, Singapore  

Olof Engstrom, Microtechnology and Nanoscience Chalmers University of Technology, Sweden  

Licheng Fei, Shanghai Nano Technology Promotion Center, China

Lian Gao, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China

Avik Ghosh, Department of Electrical and Computer Engineering, University of Virginia, USA

Alexander Govorov, Ohio University, USA  

Shouwu Guo, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China

Liyuan Han, National Institute for Materials Science, Japan

Dannong He, National Engineering Research Center for Nanotechnology, China

Chenguo Hu, College of Physics, Chongqing University, China

Chennupati Jagadish, Australian National University, Australia 

Mietek Jaroniec, Department of Chemistry & Biochemistry, Kent State University, USA

Kourosh Kalantar-Zadeh, School of Electrical and Computer Engineering, RMIT University, Australia

Junyong Kang, Department of Physics, Pen Tung Sah MEMS Research Center, Xiamen University, China

Stefan Kaskel, Department of Inorganic Chemistry, Dresden University of Technology, Germany

Pantelis C. Kelires, Cyprus University of Technology, Cyprus

Wolfgang Knoll, Austrian Institute of Technology, Australia

Nicholas A Kotov, University of Michigan, USA

Joong Hee Lee, Department of BIN Fusion Technology, Chonbuk National University, Korea, Republic Of

Yat Li, PBSci-Chemistry and Biochemistry, University of California, USA

Shaohua Liu, Technische Universitat Dresden, Germany

Mingce Long, School of Environmental Science and Engineering, Shanghai Jiao Tong University, China

Krzysztof Matyjaszewski, Department of Chemistry, Carnegie Mellon University, USA

Ulrich Mescheder, Institute for Applied Research Coordinator of Center for Microtechnology and System integration, Germany

Igor Nabiev, Université de Reims Champagne-Ardenne, France

Richard Notzel, Technical University of Madrid, Netherlands

Anlian Pan, Director, Key lab for Micro-Nano Physics and Technology of Hunan Province, Hunan University, China 

Nam-Gyu Park, School of Chemical Engineering, Sungkyunkwan University, Korea

Rob Pullar, Department Engenharia de Materiais e Cerâmica CICECO, Universidade de Aveiro, Campus Universitário de Santiago, Portugal

Martin Pumera, School of Physical and Mathematical Sciences, College of Science, Nanyang Technological University, Singapore

Harry E. Ruda, University of Toronto, Canada

Gregory J. Salamo, University of Arkansas, USA

Udo Schwingenschlögl, Physical Sciences and Engineering Division, Kingdom of Saudi Arabia

Sudipta Seal, Advanced Materials Processing Analysis Centre and Nanoscience Technology Center, University of Central Florida, USA

Surbhi Sharma, School of Biosciences, The University of Birmingham, UK

Wenzhong Shen, Department of physics, Shanghai Jiao Tong University, China

Edison Z. da Silva, Instituto de Física Gleb Wataghin UNICAMP, Brazil 

Charles Christopher Sorrell, School of Materials Sci. & Eng. UNSW Australia (The University of New South Wales), Australia

Rajender S. Varma, U. S. Environmental Protection Agency National Risk Management Research Laboratory Sustainable Technology Division, USA

Jing Wang, University of South Florida, USA

Xiaolin Xie, Dean of School of Chemistry & Chemical Engineering, Huazhong University of Science and Technology, China

Hongqi Xu, Solid State Physics/Nanometer Structure Consortium, Lund University, Swede

Shengyong Xu, Key Lab for the Physics and Chemistry of Nanodevices of MOE, Peking University, China

Desheng Xue, School of Physical Science and Technology, Lanzhou University, China

 Shengfu Yang, EPSRC Advanced Research Fellow, Department of Chemistry, University of Leicester, UK

John T.W. Yeow, University of Waterloo, Canada  

Bin Yu, College of Nanoscale Science & Engineering, State University of New York, USA 

Baoping Zhang, School of Physics and Mechanical & Electrical Engineering, Xiamen University, China

Norman Zhou, Department of Mechanical Engineering, University of Waterloo, Canada

 

Editorial Office Members 

Executive Editor, Liying Zhang, Shanghai Jiao Tong University, China 

Managing Editor, Rong He, Shanghai Jiao Tong University, China 

Assistant Editors  

Ran Chen, Institute of Computational Comparative Medicine (ICCM), Kasas State University, USA

Zheng Fan, University of California, Los Angeles, USA

Nantao Hu, Shanghai Jiao Tong University, China  

Yang Lu, Department of Electrical and Computer Engineering, University of Florida, USA

Yanjie Su, Shanghai Jiao Tong University, China   

Jinmin Wang, School of Urban Development and Environmental Engineering, Shanghai Second Polytechnic University, China 

Xiang Wu, Shenyang University of Technology, China

Peiyi Parry Ye, Department of Materials Science and Engineering, University of California Berkeley, USA

Zhihua Zhou, University of Electronic Science and Technology of China, China