Nano-Micro Letters

Editor-in-Chief  
Yafei (Anderson) Zhang 
Director, Thin Film and Microfabrication Technology Laboratory of Ministry of Education 
School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, Shanghai, China 
E-mail:  yfzhang@sjtu.edu.cn
Co-Editors 
Yoshinori Ando 
Department of Materials Science and Engineering, Meijo University, Japan 
Shiogamaguchi 1-501, Tempaku-ku, Nagoya, Japan E-mail:  yando@ccmfs.meijo-u.ac.jp
Zhiming M. Wang 
Professor of National 1000-Talents Program, State Key Laboratory of Electronic Thin Film and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China. E-mail:  zhmwang@gmail.com 
Associate Editors 
Yongming Chai, College of Chemical Engineering, China University of Petroleum (East China), China 
Kwang-Leong Choy, Director of the UCL Centre for Materials Discovery, University College of London, UK 
Jing Guo, Department of Electrical and Computer Engineering, University of Florida, USA
Liyuan Han, National Institute for Materials Science, Japan
Yarub Al-Douri, Institute of Nano Electronic Engineering, University Malaysia Perlis, Malaysia
Antonio Guerrero, Institute of Advanced Materials, Universitat Jaume I, Spain
Yang Hou, College of chemical and biological engineering, Zhejiang University, China 
Jingquan Liu, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China
Guoquan Min, Shanghai Nano Technology Promotion Center, China 
Zhichuan J. Xu, School of Materials Science and Engineering, Nanyang Technological University, Singapore
Jun Yang, Department of Mechanical and Materials Engineering, The University of Western Ontario, Canada
Zhi Yang, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China
Qing Zhang, Nanyang Technological University, Singapore
Baoxue Zhou, School of Environmental Science and Engineering, Shanghai Jiao Tong University, China
Norman Zhou, Department of Mechanical Engineering, University of Waterloo, Canada
Editorial Board Members
Anil K. Bhowmick, Rubber Technology Centre, Indian Institute of Technology, India
Zheng BO, State Key Laboratory of Clean Energy Utilization, College of Energy Engineering, Zhejiang University, China
Hugh J. Byrne, Dublin Institute of Technology, Ireland
Changxin Chen, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China
Guangming Chen, Shenzhen University, China
Daxiang Cui, Institute of Nano Biomedicine and Engineering, Shanghai Jiao Tong University, China
Olof Engstrom, Microtechnology and Nanoscience Chalmers University of Technology, Sweden
Licheng Fei, Shanghai Nano Technology Promotion Center, China
Chao Gao, Department of Polymer Science and Engineering, Zhejiang University, China
Alexander Govorov, Ohio University, USA  
Shouwu Guo, School of Electronic Information and Electronic Engineering, Shanghai Jiao Tong University, China
Dannong He, National Engineering Research Center for Nanotechnology, China
Chenguo Hu, College of Physics, Chongqing University, China
Nantao Hu, School of Electronics, Information and Electrical Engineering, Shanghai Jiao Tong University, China
Shaoming Huang, College of Chemistry and Materials Engineering, Wenzhou University, China
Chennupati Jagadish, Australian National University, Australia 
Mietek Jaroniec, Department of Chemistry & Biochemistry, Kent State University, USA
Kourosh Kalantar-Zadeh, School of Electrical and Computer Engineering, RMIT University, Australia
Junyong Kang, Department of Physics, Pen Tung Sah MEMS Research Center, Xiamen University, China
Stefan Kaskel, Department of Inorganic Chemistry, Dresden University of Technology, Germany
Wolfgang Knoll, Austrian Institute of Technology, Australia
Joong Hee Lee, Department of BIN Fusion Technology, Chonbuk National University, Korea
Hyoyoung Lee, Sungkyunkwan University, Korea 
Yat Li, PBSci-Chemistry and Biochemistry, University of California, USA
Lijie Li, School of Engineering, Swansea University, UK
Chenguang Liu, College of Chemical Engineering, China University of Petroleum (East China), China
Shaohua Liu, School of Physics and Materials Science, East China Normal University, China
Mingce Long, School of Environmental Science and Engineering, Shanghai Jiao Tong University, China
Jianmin Ma, School of Physics & Electronics, Hunan University, China
Shun Mao, College of Environmental Science and Engineering, Tongji University, China
Igor Nabiev, Université de Reims Champagne-Ardenne, France
Xiaoming Niu, Shanghai Academy of Science & Technology, China 
Jianyong Ouyang, Department of Materials Science and Engineering, Faculty of Engineering, National University of Singapore, Singapore
Anlian Pan, Director, Key lab for Micro-Nano Physics and Technology of Hunan Province, Hunan University, China 
Nam-Gyu Park, School of Chemical Engineering, Sungkyunkwan University, South Korea
LOH Kian Ping, Department of Chemistry, Faculty of Science, National University of Singapore, Singapore
Rob Pullar, Department Engenharia de Materiais e Cerâmica CICECO, Universidade de Aveiro, Campus Universitário de Santiago, Portugal
Martin Pumera, School of Physical and Mathematical Sciences, College of Science, Nanyang Technological University, Singapore
Harry E. Ruda, University of Toronto, Canada
Gregory J. Salamo, University of Arkansas, USA
Udo Schwingenschlögl, Physical Sciences and Engineering Division, Kingdom of Saudi Arabia
Sudipta Seal, Advanced Materials Processing Analysis Centre and Nanoscience Technology Center, University of Central Florida, USA
Surbhi Sharma, School of Biosciences, The University of Birmingham, UK
Wenzhong Shen, Department of physics, Shanghai Jiao Tong University, China
Zhitang Song, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China 
Charles Christopher Sorrell, School of Materials Sci. & Eng. UNSW Australia (The University of New South Wales), Australia
Yanjie Su, School of Electronics, Information and Electrical Engineering, Shanghai Jiao Tong University, China
Rajender S. Varma, U. S. Environmental Protection Agency National Risk Management Research Laboratory Sustainable Technology Division, USA
Hui Wang, Department of Physics and Astronomy, Shanghai Jiao Tong University, China
Jing Wang, University of South Florida, USA
Jiang Wu, University College London, UK
Xiaolin Xie, Dean of School of Chemistry & Chemical Engineering, Huazhong University of Science and Technology, China
Shengyong Xu, Key Lab for the Physics and Chemistry of Nanodevices of MOE, Peking University, China
Desheng Xue, School of Physical Science and Technology, Lanzhou University, China
Ya Yang, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
Jun Yang, School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, China
Bin Yu, College of Nanoscale Science & Engineering, State University of New York, USA 
Baoping Zhang, School of Physics and Mechanical & Electrical Engineering, Xiamen University, China
Wenjun Zhang, Department of Physics and Materials Science City University of Hong Kong, Hong Kong, China
Zhaohui Zhong, Department of Electrical Engineering and Computer Science, University of Michigan, USA
Editorial Office Members 
Executive Editor 
Liying Zhang, Shanghai Jiao Tong University, China 
Managing Editor
Rong He, Shanghai Jiao Tong University, China 
Zhihua Zhou, Shanghai Jiao Tong University, China
Assistant Editors  
Bo Chen, School of Materials Science and Engineering, Nanyang Technological University, Singapore
Zheng Fan, University of California, Los Angeles, USA
Guankui Long, Nanyang Technological University, Singapore
Jinmin Wang, School of Urban Development and Environmental Engineering, Shanghai Second Polytechnic University, China 
Xiang Wu, Shenyang University of Technology, China
Peiyi Parry Ye, Department of Materials Science and Engineering, University of California Berkeley, USA