Nano-Micro Letters

Nanoscale Wire-Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature

Peng Peng1, 2, Wei Guo1,*, Ying Zhu1, Lei Liu3, Guisheng Zou3, Y. Norman Zhou3, 4

Abstract
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Nano-Micro Lett. (2017) 9: 26

First Online: January 4, 2017 (Article)

DOI:10.1007/s40820-017-0126-8

*Corresponding author. E-mail: gwei@buaa.edu.cn

 

Abstract

 


Figure 3 a SEM image of FIB sample after thinning. b The STEM image of a Ag-Au cross-section after wire-bonding (with 450 µN) sliced with FIB. c The line profiles of the Ag and Au across the Ag–Au interface from the STEM image. d HRTEM image of Ag-Au interface with matched (111) lattices showing both the Ag and Au sides. e The severely deformed lattices on the Ag and Au, with the Ag showing a 4H lattice (103) at the interface. The FFT images were taken from e showing the patterns of f the Ag side, g Au side, and h interface

The controllable wire bonding of individual Ag nanowires onto a Au electrode was achieved at room temperature. The plastic deformation induced by pressure using nano-indentation could break the protective organic shell on the surface of the Ag nanowires and cause atomic contact to promote the diffusion and nano-joining at the Ag and Au interface. Severe slip bands were observed in the Ag nanowires after the deformation. A metallic bond was formed at the interface, with the Ag diffusing into the Au more than the Au diffused into the Ag. This nanoscale wire-bonding might present opportunities for nanoscale packaging and nanodevice design.


 

Keywords

Nanojoining; Bonding; Diffusion; Interface; Nano-indentation

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